| 摘要 |
PURPOSE:To improve the reliability and the economical efficiency of a semiconductor device wherein a semiconductor element is connected directly to a wiring board. CONSTITUTION:At least a palladium layer 11 is formed on a copper electrode 10 on a wiring board 12, and it is connected to a bump 3. Depending on a case, a creamy solder 13 is placed on the palladium layer 11, and the layer is connected to a bump on a semiconductor element 1. Thereby, the copper electrode 10 does not come into direct contact with a solder layer or the copper electrode 10 does not come into direct contact with the solder bump thanks to the palladium layer 11, an alloying action due to the diffusion of tin into copper which has been caused with the passage of time is not caused, and a mounting operation can be executed with extremely high reliability due to the production of pores in the solder. Alternatively, the palladium layer 11 can be formed by an electroless plating operation. This is effective in constituting a material and in simplifying a process. |
