| 摘要 |
PURPOSE:To provide the title semiconductor device capable of making the corrosion occurring in an electrode pad part hardly reach the inside of a chip and resultantly hardly be disconnected, further minimizing the chip size to the utmost. CONSTITUTION:Within the title semiconductor device wherein lead terminals 2 are formed in a package, the electrode pads 4 formed on a semiconductor chip 3 are connected by wires 5 in the wire-bonding step while the electrode pad 4 not connected by said wire 5 is connected to a wiring 6c inside the chip 3 by a connecting wiring 6b formed on the semiconductor chip 3, said connecting wiring 6b is formed as if detouring around said electrode pad 4. |
