MANUFACTURE OF SOLID FORMED SUBSTRATE

摘要

PURPOSE:To provide a sure manufacture method which is free from circuit pattern deviation by arranging a circuit film accurately at a part which becomes an inside bottom part of a solid formed body. CONSTITUTION:A circuit film 40 is arranged in a die surface 32 of a movable side die 30 with a projecting part 31 which enters a recessed part of a fixed side die 20 with a recessed part 21 and a circuit pattern 42 is integrally formed simultaneously with formation of a formed body. In the process, a convex part 23 which is in contact with the projecting part 31 through the circuit film 40 is projectingly provided inside the recessed part 21 of a fixed side die. A circuit film attracting hole part 33 which is smaller than the convex part 23 is provided to the movable side die surface 32 corresponding to the convex part 23, the circuit film 40 is attracted and fixed to the movable side die surface 32 by the attracting hole part 33 and a substrate formed item is formed.