| 摘要 |
PURPOSE:To correctly mount electronic parts without causing displacement of parts or generation of defective soldering on the occasion of mounting electronic parts. CONSTITUTION:In a wiring board where a wiring pattern 2 formed by patterning of a conductive layer is provided on an insulating base material 1, a through hole formed as a conductor is provided in the necessary areas, a land 4 extending from a wiring pattern 2 is also formed by a conductor at the chip parts mounting region and solder resist 5 is formed to the region except for the land 4, a solder layer 6 having protruded and recessed regions is formed on the land 4. |
