| 摘要 |
PURPOSE:To lay out a foil-shaped brazing material to an island of a frame widely, supply the brazing material up to a cornered portion of a semiconductor chip and hence obtain a favorable bonded state. CONSTITUTION:A brazing material 2 punched through in a specified shape is distributed substantially all over the area of an island 1 of a lead frame. A semiconductor chip is mounted on the island 1 with this brazing material 2.
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