| 摘要 |
PURPOSE:To relax thermal stress by using a reaction product of epoxy resin having at least two epoxy groups in one molecule with a fatty monocarboxylic acid as a conductive resin. CONSTITUTION:The conductive resin paste includes epoxy resin, a hardening agent, a conductive filler and a diluent. A semiconductor device and a substrate are bonded with the conductive resin paste which is a reaction product of the epoxy resin having at least two epoxy groups in one molecule with a fatty monocarboxylic acid. After bonded, the substrate is sealed with the resin, thereby forming a semiconductor device. The monocarboxylic acid includes acetic acid, propionic acid and crotonic acid. As the hardening agent, there are included phenol borax resin and phenol aralkyl resin. In addition, the conductive filler includes gold, silver and copper particles while the diluent includes butyl Cellosolve acetate is cited. It is, therefore, possible to prevent the generation of thermal stress. |
