| 摘要 |
PURPOSE:To improve heat dissipation from a high power circuit in a high power hybrid integrated circuit including a high power circuit and a low power circuit formed therein as well as prevent a solder junction part from being cracked owing to a temperature cycle in the solder junction part of chip parts constructing the low power circuit. CONSTITUTION:A power semioconductor device 6 is mounted on a first insulating resin layer 2 having low thermal resistance in which a predetermined weight ratio is mixed, and a second insulating resin layer 5 is mounted which possesses the delay characteristics of other circuit devices such as chip parts 4 and the like. |
