HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To realize a hybrid integrated circuit device including a magnetic sensor on a diamagnetic metal substrate. CONSTITUTION:A conductive path 18 and pads 22, 24 are formed by etching a copper foil which is attached to a metal substrate 10 by using an insulating resin layer 16. A semiconductor element Qv2 is sealed to the pad 22 through a heat sink and a magnetic sensor 38 is sealed to the pad 24 through a yoke 52 which is formed of a paramagnetic material or a ferromagnetic material. Since the yoke 52 is arranged in a lower part of the magnetic sensor 38, diamagnetism of the metal substrates 10 is restrained and S/N of output of the magnetic sensor 38 is improved.