| 摘要 |
<p>PURPOSE:To obtain a required chip interval in the expanding step by a method wherein a radiation attenuating layer having almost the same plane shape as that of a wafer bonded to at least one surface of a base material is formed. CONSTITUTION:An acryl base resin containing 3wt.% of 2,4-dihydroxy benzophenone is printed in a shape of 5 inch wafer on the surface of a soft vinyl chloride film used as a base material. Next, a composition comprising 100wt.% of acryl base polymer as a bonding agent, 100wt.% of urethane acrylate base oligomer in molecular weight of 8000 and 10wt.% of hardener is cast on a release agent comprising silicone-processed polyethylene terephthalate film to be bonded onto said base material for manufacturing an adhesive tape. Next, 5 inch wafer bonded onto the printing part of this adhesive tape is fitted to a flat frame to be full-cut into 5mm square chips. At this time, the chips are irradiated with ultraviolet rays from the base material side surface and finally, a dicing tape is expanded by 15%.</p> |
