| 摘要 |
<p>PURPOSE:To simplify etching process, and reduce flaw on the surface of a substrate and adhesion of fine particles, by magnetically levitating a conveying tool on which a substrate is mounted, carrying the substrate without contact of the substrate surface, and etching the rear. CONSTITUTION:A substrate 2 is carried into a treatment chamber, and mounted on a conveying tool 4. Since a current does not flow in this case, the conveying tool 4, which mounts the substrate 2 in the state that the surface faces upward, is situated on the lower electrode 1. When a current flows through a coil 5, the conveying tool 4 mounting the substrate 2 is levitated by the magnetic repulsive force between the magnetic field generated by the coil 5 and the magnetic field generated by the conveying tool 4, and brought into contact with an upper electrode 3. In this state, reaction gas containing halogen elements is introduced into the treatment chamber from a gas introducing inlet 8. The rear of the substrate 2 is etched by applying high frequency electric voltage to the lower electrode 1. Thereby etching process is simplified. Flaw on the substrate surface and adhesion of fine particles thereon are reduced, and yield also is improved.</p> |
