| 摘要 |
PURPOSE:To improve an operating efficiency and to reduce a manufacturing cost by mounting a spacer on one or the other surface of a printed board when an electronic component is mounted on the one or the other surface of the board. CONSTITUTION:A printed board 12 is held by a pair of holding arms 17a, 17b by directing the rear surface of the board 12 upward. Then, a predetermined number of chip type electronic components 13a, electronic components 13b with leads, a spacer chip 14 on a tape 18 are removed by an oscillating arm 16, mounted at predetermined positions of a rear surface of the board 12, or temporarily secured by adhesive. Then, the board 12 is reversed by the arms 17a, 17b, its surface is directed upward and held. Predetermined numbers of the components 13a, 13b on the tape 18 are placed at predetermined positions of the front surface of the board 12 by the arm 16. Further, the board 12 is heated from below the board 12, and primarily secured by reflow soldering. Thus, the number of steps can be reduced. |
