| 摘要 |
<p>PURPOSE:To enable a power conversion device high in output power and small in size to be obtained by a method wherein a larger electrical output or a power of higher frequency can be taken out from a semiconductor by enabling heat released from it to be easily and surely dissipated. CONSTITUTION:Power semiconductor elements such as a diode, a thyristor, and a transistor are combined with electronic components such as a capacitor, a reactor, a transformer, and a resistor so as to form a switching power conversion circuit on an insulating board 11 by soldering 15 using copper foil patterns 12 and 13 and a bonding wire 14 for the formation of a power conversion device, where a watertight space 18 is provided onto the insulating board 11 by a watertight vessel 16, the surface of a semiconductor element high in heat release value is rendered a narrow space 18a, and coolant 2 high in insulating property is made to circulate forcibly through the watertight space 18.</p> |
