ANISOTROPIC PLASMA ETCHING OF TUNGSTEN,申请号HK19930000074-传众专利搜索

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发明名称	ANISOTROPIC PLASMA ETCHING OF TUNGSTEN
摘要
申请公布号	HK7493(A)	申请公布日期	1993.02.12
申请号	HK19930000074	申请日期	1993.02.04
申请人	INTEL CORPORATION	发明人	CHI-HWA TSANG
分类号	H01L21/302;C23F4/00;H01L21/3065;H01L21/3213;(IPC1-7):C23F1/12	主分类号	H01L21/302
代理机构		代理人
主权项
地址

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