摘要 |
A semiconductor mounting system is provided for the detachable surface mounting of one or more semiconductor dies on a conductor substrate, such as a ceramic substrate or printed circuit board. The system employs a resilient, anisotropic conductor pad (10) which is interposed between the semiconductor die (20) and the conductor substrate (22) The conductor pad is capable of conducting electric signals in one direction only, and insulates in the other two orthogonal directions. Thus, by compressing the semiconductor die and resilient conductor pad against the conductor substrate, electrical contact is established between contacts on the semiconductor die and corresponding contacts on the conductor substrate. In the preferred embodiment, additional conductor pads are placed over the semiconductor dies, and a heat sink placed over the second conductor pads. In this way, the semiconductor dies are mounted in a resilient structure for protection, while heat dissipation is enhanced by the metallic elements in the second conductor pad. |
申请人 |
DIGITAL EQUIPMENT CORP., MAYNARD, MASS., US |
发明人 |
LEE, JAMES C.K., LOS ALTOS HILLS CALIFORNIA 94022, US;AMDAHL, GENE M., ATHERTON CALIFORNIA 94025, US;BECK, RICHARD, CUPERTINO CALIFORNIA 95014, US;LEE, CHUNE, SAN FRANCISCO CALIFORNIA 94121, US;HU, EDWARD, SUNNYVALE CALIFORNIA 94087, US |