发明名称 |
VERFAHREN ZUM HALTEN EINER PLATTE, PLATTENTRAEGER UND PLATTENMONTAGEVORRICHTUNG MIT DEM PLATTENTRAEGER |
摘要 |
A method of supporting a wafer comprising the steps of: dividing a pressure space formed between the table plate and the wafer into a first pressure space and a second pressure space by means of a pressure setting wall, setting a supporting pressure of a compressed air supplied to the first pressure space, by a throttle function of a throttle passage formed between a pressure regulating wall and the wafer, and determining a further supporting pressure of the compressed air supplied from the first pressure space to the second pressure space through the throttle passage, by a throttle function of a throttle opening for connecting the second pressure space with the atmosphere. A wafer supporting apparatus for carrying out the method and a wafer mounter having the apparatus. |
申请公布号 |
DE4142272(A1) |
申请公布日期 |
1993.02.11 |
申请号 |
DE19914142272 |
申请日期 |
1991.12.20 |
申请人 |
TEIKOKO SEIKI K.K., SAKAI, OSAKA, JP |
发明人 |
LEE, MASAHIRO, SAKAI, OSAKA, JP |
分类号 |
H01L21/301;H01L21/683 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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