| 摘要 |
<p>A memory system package is provided by placing memory chips (2) face-to-face using as an interposer a thin flexible carrier (6) having through-carrier-connections, vias (14), for common memory chip I/O pads (4) which are brought out to access external signals, either control, I/O or power. These external signals may also be wired to memory chip pads that are not common. <IMAGE></p> |
