发明名称 STRUCTURE FOR SUPPORTING A RESONATOR USING AN ULTRATHIN PIEZOELECTRIC PLATE IN A PACKAGE
摘要 PCT No. PCT/JP90/01527 Sec. 371 Date Oct. 9, 1991 Sec. 102(e) Date Oct. 9, 1991 PCT Filed Nov. 22, 1990 PCT Pub. No. WO91/12663 PCT Pub. Date Aug. 22, 1991.In a piezoelectric resonator having an ultrathin vibratory portion formed by a cavity made in a piezoelectric block and a thick frame-like rib formed integrally with said vibratory portion and surrounding it, an excess adhesive receiving groove or the like is cut in one marginal portion of the frame-like rib between an adhesive coated region. The resonator is fixedly housed in a package by use of an adhesive coated on one marginal portion of the frame-like rib along the z-axis direction, or by means of elastic pawls without using the adhesive. In this case, one marginal portion of the frame-like rib on the opposite side from a pad deposited on one side of the piezoelectric resonator is bonded to the bottom of the package. With such a structure, it is possible to prevent the adhesive from flowing into the cavity to cause variations in the resonance frequency of the piezoelectric resonator, to reduce the scatter of the temperature-frequency characteristic of a piezoelectric device using the resonator housed in a package during mass production, and to increase the bond strength of wire bonding for electrical connection of the piezoelectric resonator incorporated in the package.
申请公布号 US5185550(A) 申请公布日期 1993.02.09
申请号 US19910768923 申请日期 1991.10.09
申请人 TOYO COMMUNICATION EQUIPMENT CO., LTD. 发明人 MORITA, TAKAO;ISHII, OSAMU;KUROSAKI, TAKEBUMI
分类号 H03H3/02;H03H9/05;H03H9/10;H03H9/17;H03H9/19 主分类号 H03H3/02
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