| 发明名称 |
Bath and method for electrodepositing tin, lead and tin-lead alloy |
| 摘要 |
A bath for electrodepositing tin, lead or an alloy thereof, containing a tin and/or lead ion and a sulfate ion becomes stable at pH 1 or higher when a condensed phosphate ion is added thereto. The bath is effective for depositing tin-lead alloy films on sealing glass-metal integrated articles.
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| 申请公布号 |
US5185076(A) |
申请公布日期 |
1993.02.09 |
| 申请号 |
US19910684321 |
申请日期 |
1991.04.12 |
| 申请人 |
C. UYEMURA & CO., LTD. |
发明人 |
YANADA, ISAMU;MURAKAMI, TOORU;ASAKAWA, KIYOSHI |
| 分类号 |
C03C17/10;C25D3/30;C25D3/34;C25D3/56;C25D3/60;C25D7/00 |
主分类号 |
C03C17/10 |
| 代理机构 |
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