发明名称 MANUFACTURE OF SEMICONDUCTIVE ENDLESS BELT
摘要 PURPOSE:To constitute the above method so that neither an offset in running nor creases are generated by simple structure. CONSTITUTION:A heat-resistant resin pipe 3 which possesses the higher coefficient of thermal expansion than that of a steel pipe 2 and is in a state of a drum is arranged within the steel pipe 2 and at least the resin pipe 3 and a thermoplastic sheet 1 are heated under a state where the thermoplastic 1 molded into a state of an endless belt is arranged on the outer circumference of the resin pipe 3. Then, the thermoplastic sheet 1 is softened and the resin pipe 3 is expanded by this heating and the thermoplastic sheet 1 is pressurized by placing the thermoplastic sheet 1 between the resin pipe 3 and steel pipe 2. Then, the same is cooled, the resin pipe 3 is separated from the steel pipe 2 under a state where the thermoplastic sheet 1 is stuck close to the resin pipe 3 and the thermoplastic sheet 1 is made into a state of almost a drum.
申请公布号 JPH0531820(A) 申请公布日期 1993.02.09
申请号 JP19910216250 申请日期 1991.07.31
申请人 TOKAI RUBBER IND LTD 发明人 YASUI EIJI;ITO KENICHI
分类号 B29D29/00;G03G15/08;G03G15/16;G03G21/00 主分类号 B29D29/00
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