发明名称 |
Non-wicking solder preform |
摘要 |
Wicking-resistant solder preforms and methods for making such preforms are provided. The preforms include a solder layer for electrically mounting a lead to a printed circuit board upon heating the solder above its flow temperature. The preform also includes a flux layer disposed in contact with the solder layer and a wicking barrier disposed on a component-facing side of the solder layer for minimizing solder wicking along the lead during subsequent reflow soldering operations.
|
申请公布号 |
US5184767(A) |
申请公布日期 |
1993.02.09 |
申请号 |
US19910816134 |
申请日期 |
1991.12.31 |
申请人 |
COMPAQ COMPUTER CORPORATION |
发明人 |
ESTES, HOWARD S. |
分类号 |
B23K35/02;B23K35/14;B23K35/26;H05K3/34 |
主分类号 |
B23K35/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|