| 摘要 |
<p>PURPOSE:To provide a method for manufacturing a thick film circuit board having excellent features, which has a simple line structure and a small facility investment amount, and can suppress dispersion of exhibiting resistance value of a formed resistor to a small value. CONSTITUTION:First, thick film resistor paste is printed on an alumina board 1, dried, then thick film Ag/Pt paste is printed, dried as it is without baking, both dried films are simultaneously baked to form electrodes, wirings for connecting a semiconductor chip, component lands 2 and a resistor 3 at the same time, then thick film overcoating glass is printed, dried and baked to form a circuit protecting overcoating glass 4. Thus, large effects can be realized at the points of a line structure, a facility investment amount, dispersing degree of exhibiting resistance value of the resistor.</p> |
