发明名称 METHOD OF PROCESSING SEMICONDUCTOR EXPOSURE APPARATUS
摘要 PURPOSE:To provide a method for processing a wafer, which eliminates a wasteful time for preparing the wafer and can efficiently operate an apparatus. CONSTITUTION:In a method for processing a semiconductor exposure apparatus having a step 1 of conveying a preceding wafer, a step 2 of processing the wafer, a step 4 of deciding a processed result of the wafer, a step 3 of conveying a wafer to be processed next to the preceding wafer, a step 5 of generating a lot process start command of a wafer, and a step 6 of lotprocessing the wafer, the step 3 of conveying the wafer to be processed next is executed in parallel with the step 2 of processing the preceding wafer.
申请公布号 JPH0529191(A) 申请公布日期 1993.02.05
申请号 JP19910203520 申请日期 1991.07.19
申请人 CANON INC 发明人 YAMADA YASUMI
分类号 H01L21/30;H01L21/027;H01L21/66 主分类号 H01L21/30
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