| 摘要 |
<p>PURPOSE:To quickly and accurately investigate the cause of a pattern matching error and to guarantee the reference accuracy of a dicing apparatus by a method wherein a reference wafer for inspection use is formed and an inspection is performed by using the reference wafer. CONSTITUTION:Grid-shaped cutting lines 1a are formed on a reference wafer 1 so as to conform to a semiconductor wafer 1; a special pattern is indicated in each section 1b surrounded by the cutting lines 1a. A plurality of sets of marks 2 which are composed of a circle 21, a square 22, a parallel cross 23 and a cross 24 as one set are arranged in a region in the central part by changing their size. They are indicated while their background is set in black and they are printed in white on a black background. The plurality of sets of marks 2 are arranged also in peripheral parts by changing their size while they are indicated in a positive-pattern manner. Alphabetical characters 3 and numerals 4 are indicated in a positive-pattern manner by changing their size along peripheral edge parts of the region of a pattern P. An identification mark 5 to discriminate a direction is indicated at the upper left corner part in the region of the pattern P. By using the reference wafer 1, the alignment function of a dicing apparatus and the dynamic accuracy of its action elements are inspected.</p> |
