| 摘要 |
<p>PURPOSE:To simplify the manufacturing process by polishing surfaces of a mother board so as to remove lower-layer electrodes, and then, cutting the mother board so as to cut out a semiconductor element where the lower-layer electrodes are made only on both end faces. CONSTITUTION:The lower-layer electrodes made on both main surfaces are removed by polishing both main surfaces after forming the lower-layer electrodes 2, which has ohmic property, on the surface of the mother board 10 made of a semiconductor for a positive characteristic thermistor, by electrode Ni plating or the like. Thus the lower-layer electrodes 2 are made only on the sides the end faces. And this mother board is cut along the line B, whereby a semiconductor element 1, where the lower-layer electrodes 2 are made only on the end faces, are cut out. Hereby, the manufacturing process can be simplified.</p> |
