HIGH-FREQUENCY MULTILAYER CIRCUIT SUBSTRATE ADJUSTING METHOD

摘要

PURPOSE:To enable the impedance adjusting of a multilayer substrate by cutting the surface of the multilayer substrate and forming an electrode on the surface. CONSTITUTION:In a multilayer substrate, a bottom surface 103 of this multilayer substrate is grounded, parts are mounted on a bottom surface 102 and at least one of a power source line or a signal line is constituted to pass an intermediate layer 101. A strip line structure is made by sandwiching the power source line or the signal line between ground lines 103, 105 of the both top and bottom surfaces. The electrode of the upper part of this power source line or the signal line is defined as an ground electrode 105. By shaving or forming this ground electrode 105, the impedance of the power source line or the signal line is changed and adjusted. Thus, the impedance adjusting of the multilayer substrate can be easily performed and a small-sized high frequency circuit substrate can be used.