| 摘要 |
PURPOSE:To realize a hybrid integrated circuit having high bonding reliability by a method wherein a uniform roughness of the surface of a wire bonding aluminum junction plane. CONSTITUTION:An insulating layer 2 is provided on a metallic substrate 1 and a clad foil 3 comprising a copper foil 4 and an aluminum foil is provided in the insulating layer 2. Next, a circuit having a bonding aluminum junction plane and a soldering copper foil part at the time of mounting a component is etched on the clad foil 3. One side of an aluminum or golden wire is connected to the formed aluminum junction plane, while the other side thereof is connected to a semiconductor 8. At this time, a uniform roughness of the surface of the aluminum junction plane is set at 10mum or less by grinding. Thus, a generation of defective wire bonding of the aluminum and golden wires can be prevented, and a hybrid integrated circuit having high reliability in the wire bonding can be provided. |
