| 摘要 |
PURPOSE:To economically form an inspection mark, which is used for inspecting mounting accuracy of chip components after the mounting thereof, with high accuracy and easily execute the inspection of chip components mounted high in density. CONSTITUTION:Each end part of a wiring pattern 2 which is formed on an insulating base material 1 by patterning of a conductive layer is provided with chip component mounting lands 3a and 3b, an inspection mark 4 is formed by conductive layer simultaneously with the lands 3a and 3b therebetween and a solder resist 5 is also formed covering the part except for the lands 3a and 3b. |
