| 摘要 |
<p>PURPOSE:To facilitate the control of the thickness of a formed film and elevate the reliability of a device by reducing the formation of a film on the wafer installation part on a tray, the adhesion of foreign matter on a wafer, and others. CONSTITUTION:A wafer heater mechanism 6 is provided besides a tray heater mechanism 3. The entire tray 1 is heated with the tray heater mechanism 3. The wafer heater mechanism 6 heats a wafer 2. Hereby, the adhesion of foreign matter on that area of the tray which the wafer does not occupy can be prevented, so a film can grow without foreign matter adhering to the wafer 2.</p> |
