| 摘要 |
<p>PURPOSE:To eliminate necessity of aligning a semiconductor chip, to simplify an operation, and to simultaneously hold an alignment accuracy in a method for connecting the chip by a conventional solder bump. CONSTITUTION:A second silicon substrate 1B having an opening 6 for engaging a semiconductor chip is adhered to a first silicon substrate 1A having a circuit pattern and a solder bump connecting part, the chip 5 is then engaged, heated and connected. Then, after a photoresist film 7 is formed only on the chip 5, the substrate 1B is removed.</p> |
