| 摘要 |
PURPOSE:To prevent a contact defect by a method wherein, while a frame is left and an external lead is kept in a rectlinear state and in a state that it is cut off from the frame, a characteristic test is performed. CONSTITUTION:An island 1 is supported, via suspension pins 7, in the center of a rectangular frame 5. By using a lead frame provided with outer leads 4 extended to the side-face direction of the island 1, each pad 3 on each semiconductor chip 2 fixed and bonded to the island 1 is connected to each outer lead 4 by means of a metal thin wire 6. This assembly is resin-sealed with a resin 8 for sealing use; after that, the outer leads 4 are cut off from the frame 5. When an electric characteristic test is performed, it is performed while the frame 5 is left and the external leads in a rectlinear state are mounted on a test jig. Since the outer leads 4 are protected by the frame 5, a chance that the outer leads 4 are touches is reduced while a semiconductor device is handled during the characteristic test. The outer leads are not deformed such as bent or the like. Since the outer leads 4 are rectlinear, their electrical connection can easily and surely be made. |
