Mounting and contacting device on circuit board by silver@ bonding - using two component adhesive of resin contg. microencapsulated hardener and accelerator, useful for non-metallic circuit boards, conductive films, etc.

摘要

In mounting and contacting devices on circuit boards by the conducting Ag bonding process, two component adhesives (I) are used, in which the hardener and accelerator phases are micro-encapsulated with an organic material and exposed in the reactive resin phase by mechanical force during mounting, so that they cause cold cure. Pref. (I) are applied to the contact points of the devices or the base contacts of the circuit boards. Specific mechanical force is applied to the device by the mounting head and a transversal and/or longitudinal vibration is applied at the same time. Pref. (I) contain fine Ag-(Pd) powder and microcapsules with a dia. of 10-100, pref. 20-50 microns. USE/ADVANTAGE - (I) are stable in storage and react quickly in the cold, after mechanical activation, forming stable firm contact. The technique is suitable for mounting devices on metals, non-metallic circuit boards, conductive films, graphite C tracks, intrinsically conductive polymers and metals which are difficult to solder or cannot be soldered