| 摘要 |
An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like. |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US |
发明人 |
CLEMENTI, ROBERT JOSEPH, BINGHAMTON NEW YORK 13901, US;GAZDIK, CHARLES EDWARD, ENDICOTT NEW YORK 13760, US;LAFER, WILLIAM, CHENANGO BRIDGE NEW YORK 13745, US;LOVESKY, ROY LEWIS, VESTAL NEW YORK 13850, US;MCBRIDE, DONALD GENE, BINGHAMTON NEW YORK 13903, US;MUNSON, JOEL VERN, PORT CRANE NEW YORK 13833, US;SKARVINKO, EUGENE PETER, BINGHAMTON NEW YORK 13905, US |
