发明名称 |
Semiconductor wafer washing device - has front and rear wafer sides covered always with even film of clean water using min. amt. of water |
摘要 |
The washing equipment involves a nozzle (5) for spraying fine, frozen particles (4) and a wafer holder arm (6) which holds a semiconductor wafer (7) in a position to which the jet of fine, frozen particles (4) is directed. A movement device (8) moves the holder arm (6) in relation to the spray nozzle (5) so that virtually the total surface of the wafer (7) is washed by the sprayed particles. Fitted to the holder arm is a clean water nozzle (14) for movement in common with the wafer and for the formation of a water film on a washed wafer surface to prevent adhesion of dirt.
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申请公布号 |
DE4222272(A1) |
申请公布日期 |
1993.02.04 |
申请号 |
DE19924222272 |
申请日期 |
1992.07.07 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
YAMASAKI, SHIRO, FUKUOKA, JP |
分类号 |
H01L21/304;B08B17/04;H01L21/00;H01L21/306 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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