Photosensitive compsn. contg. resin, soln. inhibitor and sulphonyl cpd. - used as photo-acid for photoresist with high sensitivity, resolution and stability

摘要

Photosensitive compsn. contains an alkali-soluble resin (I); a cpd. (IIA) with an acid-hydrolysable substit., which forms an alkali soluble gp. on hydrolysis or a cpd. (IIB) crosslinking (I) in the presence of an acid; and a sulphonyl cpd. of formula (III), which forms an acid on exposure: R11 = a monovalent organic gp., opt. with halogen, nitro or CN substit(s).; R12-14 independently = H, halogen, NO2, CN or as R11. The claims also cover a mixt. contg. 0-30 pts. polyvinylphenol (IA), 30-100 pts. polyvinylphenol partly blocked by tert.-butyl acetate and 1-30 pts. phenylsulphonylacetonitrile (IIIA). There is no reference to the prepn. of (III). USE/ADVANTAGE - The compsn. is useful as resist material, e.g. for microstructurisation in electronics. It has high sensitivity, resolution and stability and can be used with short UV radiation, ionising radiation etc.