| 摘要 |
<p>A method for manufacturing a recording head with integrally housed functional elements, said process comprises the steps of: (a) providing a plurality of base members respectively having a single-crystal semiconductor layer thereon, (b) bonding said single-crystal semiconductor layers of said plurality of base members to the surface of a common substrate in a face-to-face state, (c) removing said plurality of base members such that said single-crystal semiconductor layers are remained on said common substrate, and (d) forming semiconductor functional elements on said common substrate while forming an electrothermal transducer serving to generate thermal energy on said common substrate using said single-crystal semiconductor layers. <IMAGE></p> |
