发明名称 |
POLY-HYDROXYNAPHTHALENE COMPOUNDS AND EPOXY RESIN COMPOSITION |
摘要 |
Copolycondensation of alpha -naphthol and beta -naphthol with an aldehyde compound gives a poly-hydroxynaphthalene compound having an average molecular weight of 300 to 2,000. This compound is useful as a curing agent for epoxy resins and as a precursor of epoxy resins. Epoxy resin compositions include (1) compositions comprising an epoxy resin and the poly-hydroxynaphthalene compound as a curing agent and (2) compositions comprising an epoxy resin obtained by reacting the poly-hydroxynaphthalene compound with an epihalohydrin and a curing agent. The epoxy resin compositions of the invention are characterized in that the cured resins have a high glass transition temperature and high heat stability and high moisture resistance, scarcely allowing package cracking even in soldering treatment. Therefore the compositions are suited for use in encapsulating semiconductors. |
申请公布号 |
EP0524433(A3) |
申请公布日期 |
1993.02.03 |
申请号 |
EP19920110397 |
申请日期 |
1992.06.19 |
申请人 |
DAI-ICHI KOGYO SEIYAKU CO., LTD.;NITTO DENKO CORPORATION |
发明人 |
NAKA, AKIHIRO;ITO, SHUICHI;AKIZUKA, SHINYA |
分类号 |
C08G8/08;C08G59/32;C08L63/00;H01B3/40;(IPC1-7):C08G10/02;C08G59/02 |
主分类号 |
C08G8/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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