发明名称 |
DEVICE FOR PROCESSING HARD BRITTLE MATERIAL |
摘要 |
PURPOSE:To obtain the above processing device of long life and high speed processing device for a hard, brittle material such as ceramic or the like without using loose abrastive grains by using the device as a multiwire saw using a fixed abrasive grain wire. CONSTITUTION:A fixed abrasive grain wire 16 with diamond abrasive grains electrodeposited on its surface is used in a multiwire saw which forms a processing wire row 17 by winding a wire 16 disposed in tension between two bobbins 10 and 12 on a plurality of multi-channels wheels 5-8 and processes a hard, fragile material 80 by driving the wire 16 when the wire 16 is delivered and wound at the given speed alternately by the two bobbins 10 and 12. |
申请公布号 |
JPH0524034(A) |
申请公布日期 |
1993.02.02 |
申请号 |
JP19910203196 |
申请日期 |
1991.07.18 |
申请人 |
ISHIKAWA KENICHI;FUJIKOSHI KIKAI KOGYO KK |
发明人 |
ISHIKAWA KENICHI |
分类号 |
B24B27/06;B28D1/08;B28D5/04 |
主分类号 |
B24B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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