发明名称 |
Method for holding a strip of conductive lead frames |
摘要 |
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
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申请公布号 |
US5182851(A) |
申请公布日期 |
1993.02.02 |
申请号 |
US19910796419 |
申请日期 |
1991.11.22 |
申请人 |
SGS-THOMSON MICROELECTRONICS, INC. |
发明人 |
BOND, ROBERT H.;OLLA, MICHAEL A.;MORRISON, BARRY;GARRISON, LINN C. |
分类号 |
H01L21/60;H01L21/68;H01L23/495 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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