| 摘要 |
This invention relates to a heat dissipation apparatus for cooling a number of heat generating electrical components mounted on a printed circuit board, some of which components are arranged in pairs, each pair being separated by a space. The apparatus includes two heatsinks positioned such that the parallel, thermally conductive walls of the heatsinks are adjacent to the heat transfer surfaces of the components. Disposed within the space separating a given component pair is a pressing fastener which has a yoke with a V-shaped recess into which is positioned a wedge. The positioning of the wedge in the recess is adjusted by means of a screw, resulting in the tines of the yoke spreading as the wedge is drawn within the recess. As the tines spread, they engage the paired components pressing them in contact with the heatsink walls. Finally, as the screw is tightened, it compresses a Belleville spring which thereafter continues to apply a force on the screw, tending to urge the wedge within the recess and thereby keeping the components in pressed contact with the heatsink.
|
