发明名称 Dental bonding arrangement and method
摘要 A dental bonding arrangement for use in attaching a dental prosthesis onto a dental surface. The bonding arrangement includes a self-supporting, semi-rigid layer of adhesive material positioned between a pair of opposing backing sheets. The adhesive material is of sufficient viscosity to permit contouring of the adhesive along the dental surface, and yet of sufficient rigidity to maintain itself erect on the dental surface without flowing. The backing sheets are selectively removed to initially place the adhesive film on the dental surface and, after being positioned, removing the opposing backing sheet and then placing of the dental prosthesis. The particular dental prosthesis can be a porcelain inlay, a dental bracket, or the like.
申请公布号 US5183397(A) 申请公布日期 1993.02.02
申请号 US19890409726 申请日期 1989.09.20
申请人 WEISSMAN, BERNARD 发明人 WEISSMAN, BERNARD
分类号 A61B19/00;A61C5/00;A61C5/08;A61C7/16;A61C13/23 主分类号 A61B19/00
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