发明名称 METODO PARA PREPARAR PAQUETES ELECTRONICOS FLEXIBLES.
摘要 <p>A process for preparation of electronic packages including printed circuits wherein the circuit portions of the package are formed from a web including a plurality of circuits maintained in an array during processing. Holding tabs are provided to maintain the integrity of the array, with the holding tabs being in the form of releasable retention tabs for temporarily holding the array together and accommodating multiple-up processing of the electronic package. For certain portions of the process, the web is separated into multiple-up circuit packages wherein the circuits are disposed within the central portion of the panel, and with the lateral edges and ends collectively defining an annular circuit-free zone. Multiple fiducial points are located within or around the circuit patterns, thereby eliminating or reducing the requirement for circuit-specific tooling and permitting multiple-up handling of the circuits in each array.</p>
申请公布号 MX9102464(A) 申请公布日期 1993.02.01
申请号 MX19910002464 申请日期 1991.12.10
申请人 SHELDAHL, INC 发明人 SCOTT ALLEN LINDBLAD;GARY EMIL MEINKE
分类号 H05K1/00;H05K1/02;H05K1/18;H05K3/00;H05K3/30;H05K3/34;H05K13/00;(IPC1-7):H05K3/00 主分类号 H05K1/00
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