| 摘要 |
PURPOSE:To assure cleaning without damages and sufficient destaticizing by sealing paired chip LEDs including the lead wires thereof with a transparent sealing material and adhering a lamp house and a circuit board by the transparent sealing material. CONSTITUTION:After the paired chip LEDs 32 are disposed on the surface of the circuit board 31, an uncured resin in an uncured fluid state of a thermosetting resin, such as transparent epoxy resin or silicone resin, or photosetting resin, such as UV curing resin, which can be adhered to the surface of the circuit board 31 and the lamp house 33 is supplied onto the respective paired chip LEDs 32 and the lead wires thereof in such a manner as the resin comes into contact with a resin enclosing the paired chip LEDs 32 and the lead wires thereof and further enclosing similarly the paired chip LEDs 32 adjacent thereto on the circuit board 31. The lamp house 33 is mounted to the circuit board 31 before solidification of the resin and is then sealed by the transparent sealing material 36 formed by curing the fluid state resin by heat or light. |
