| 摘要 |
PURPOSE:To obtain a heat dissipating type semiconductor chip carrier of a structure where a metal layer provided on the inner wall of a recess where a semiconductor chip is mounted is prevented from coming into contact with a wire such as a gold wire bonded to the semiconductor chip mounted in the recess at the edge of the recess. CONSTITUTION:A metal body 2 buried in an insulating board 1 is provided with a recess 3 bored in the insulating board 1 and the metal body 2, and a metal layer 6 is provided only on the surface of the metal body 2 on the inner wall of the recess. |
