METHOD FOR BONDING WIRE BETWEEN ELECTRODE PADS OF A SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To bond wires between electrode pads with high strength and reliability. CONSTITUTION:A gold ball 28 is preliminarily formed of gold wire 27 on each electrode pad 26A laid out in the adjacent area. One end of gold bonding wire is melted and ball-bonded with the other electrode pad 16 while the other end of the bonding wire is bonded with the gold ball 28 preliminarily formed and wires are ball-bonded to all of the electrode pads. This construction increases the bonding area and eliminates the separation between the electrode pads and the gold wire.