SEMICONDUCTOR-DEVICE MOUNTING METHOD

摘要

PURPOSE:To enhance reliability by arranging a compressing device having the head in a downward protruding arc shape over electrode patterns and lead terminals, compressing and heating the electrode patterns and the lead terminals with the head of the compressing device, and connecting the electrode patterns and the lead terminals with approximately uniform strength. CONSTITUTION:A compressing device 6 has a head 7 for compressing lead terminals 4 of a lead frame 3 and electrode patterns 2 of a semiconductor-device mounting board 1. The head 7 has the downward protruding arc shape. The electrode patterns 2 and the lead terminals 4 are sequentially compressed with the head 7 of the compressing device 6 from one end side to the other end side and heated at the same time. Thus, the electrode patterns 2 and the lead terminals 4 are connected. Since the head 7 of the compressing device 6 is made to be the downward protruding arc shape, the lead terminals 4 and the electrode patterns 2 are connected with the approximately uniform strength when the arc-shaped head 7 is brought into contact with the board 1 so as to compress the board 1 from one end side to the other end side even if the semiconductor-device mounting board 1 is warped.