SEMICONDUCTOR DEVICE AND MOUNTING AND HOUSING METHOD THEREOF

摘要

PURPOSE:To enable a sealed body to be enhanced in adhesive power by a method wherein an active surface is provided to the surface region of the sealed body made to adhere to the surface of a mounting board or a tape of continuous length. CONSTITUTION:Resin sealed type semiconductor devices 1A and 1B are mounted on the surface of a printed wiring board 10, and resin sealed type semiconductor devices 1C and 1D are mounted on the other surface of the board 10, where the devices are temporarily mounted through the intermediary of an adhesive layer 4 and then actually mounted. The resin sealed type semiconductor devices 1A to 1D are those which are made by sealing up semiconductor pellets, with resin sealing body 2, where either stress relaxing agent or releasing agent is added to the resin sealing body 2. A mark 7 which indicates the designation of product and a product number is provided to the surface of the resin sealing body 2. In the resin sealed type semiconductor devices 1C and 1D which are tentatively bonded to the printed wiring board 10, an active surface 8 is formed on the surface region of the resin sealing bodies 2 to enhance them in adhesive power to the adhesive layer 4.