| 摘要 |
<p>PURPOSE:To provide a multilayer lead frame provided with a heat dissipating plate which can be enhanced in transmission characteristics and cope with an increase in power consumption by a method wherein the lead frame is formed in multilayer structure. CONSTITUTION:A ground or power supply conductor layer 21, an insulating layer 19 mounted with a semiconductor element 33 formed on the conductor layer 21, an inner lead 27 finely formed on the insulating layer 19 through etching or evaporation, and outer leads formed of a metal frame to serve as a signal lead 15b and a grounding or power supply lead 15a are provided. The inner lead 27 and the signal lead 15b of an outer lead are electrically connected together by bonding, and the grounding or power supply lead 15a of an outer lead is connected to the conductor layer 21, openings are provided to the insulating layer 19 for bonding the electrodes of a semiconductor element 33 to the conductor layer 21 by wires, and a heat dissipating plate 36 is mounted on the conductor layer 21.</p> |
