| 摘要 |
<p>PURPOSE:To increase the surface flatness of a sealing resin more than those of conventional ones without using a resin frame at all. CONSTITUTION:A chip part 2 is mounted on a board 1 and then the chip part 2 is connected with a conductor layer 4 by wires 5. Next, a sealing resin 8 is molded by transfer molding step to resin-seal the chip part 2 and the wires 5. At this time, the configuration size of a leadless chip carrier can be diminished by the size of the eliminated resin frame. Besides, the thickness size of the leadless chip carrier itself can be diminished by the increased surface flatness size of the sealing resin 8. Furthermore, the manufacturing cost can be cut down by the cost of the eliminated resin frame fitting manhours.</p> |
