| 摘要 |
PURPOSE:To improve adhesive properties with a copper foil surface, and to enhance conductivity while preventing bleeding at the time of printing by forming an electromagnetic wave shielding layer, a jumper circuit and a through- hole circuit of specific conductive coating materials respectively. CONSTITUTION:100 pts.wt. metallic copper powder, surfaces of which are coated with 0.05-0.2 pts.wt. titanate, zirconate or a mixture thereof, a 5-30 pts.wt. resol phenolic resin, a 0.5-4 pts.wt. chelate layer forming agent, 0.1-5 pts.wt. adhesive property improver and a 0.5-7 pts.wt. conductivity improver are blended as a conductive coating material forming an electromagnetic wave shielding layer 7 and a jumper circuit 6. 100 pts.wt. metallic copper powder coated with 0.05-0.2 pts.wt. titanate, zirconate or the mixture thereof, the 5-30 pts.wt. resol type phenolic resin, a 0.5-4 pts.wt. thixotropic conditioner, a 0.5-3.5 pts.wt. amino compound and the 30-l0 pts.wt. chelate layer forming agent are compounded as a conductive coating material forming through-hole circuits 5a, 5b. |
