| 摘要 |
The method for using the lower part of a bidirectional type of 64 bit integrated circuit as a wiring area to maximise the size of the wiring width comprises the stpes of forming a heating resistor film and an Al wiring film on an insulation substrate, forming pad regions (14) for Ag wire connection by using a mask pattern, forming a protection film on the heating resistor film, forming an insulation film (12) on the Al wiring film between the pad regions, and mounting a driving integrated circuit (10) on the insulation film (12) the driving IC being connected to the pad regions by using an Ag wire (8) bonding method. |
